Broadband optical end-point detection for linear chemical-mechanical planarization (CMP) processes using an image matching technique

Mechatronics

Volumn 15, Issue 3, 2005, Pages 271-290

  Yi, Jingang ^a   Xu, C Shan ^a  

^a LAM RESEARCH CORPORATION   (United States)

Author keywords

Chemical mechanical planarization (CMP); End point detection (EPD); Image matching; Interferometry; Semiconductor manufacturing

Indexed keywords

ALGORITHMS; BROADBAND NETWORKS; DEMODULATION; DIELECTRIC DEVICES; INTERFEROMETRY; REAL TIME SYSTEMS; ROBUSTNESS (CONTROL SYSTEMS); SIGNAL PROCESSING; THIN FILMS;

CHEMICAL-MECHANICAL PLANARIZATION (CMP) PROCESSES; END-POINT DETECTION; IMAGE-MATCHING; INTER-METAL DIELECTRIC (IMD) DEVICE;

IMAGING TECHNIQUES;

EID: 12444301871     PISSN: 09574158     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechatronics.2004.09.006     Document Type: Article

References (6)

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4. D.P. Huttenlocher, G.A. Klanderman, and W.J. Rucklidge Comparing images using the Hausdorff distance IEEE Trans Pattern Anal Machine Intell 15 9 1993 850 863
5. C.F. Olson Maximum-likelihood image matching IEEE Trans Pattern Anal Machine Intell 24 6 2002 853 857
6. S.Y. Kim, and Y.J. Seo Correlation analysis between pattern and non-pattern wafer for characterization of shallow trench isolation-chemical- mechanical polishing (STI-CMP) process Microelectron Eng 60 2002 357 364