Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed-loop AuSn solder line

Sensors and Materials

Volumn 18, Issue 4, 2006, Pages 199-213

  Kim, Seong A ^a   Seo, Young Ho ^a   Cho, Young Ho ^a   Kim, Geunho ^b   Bu, Jong Uk ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b LG Electronics Inc   (South Korea)

Author keywords

Hermetic MEMS packaging; Low temperature bonding; Pressurized hermeticity test; Solder line bonding

Indexed keywords

EID: 33749658185     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

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