Monte Carlo simulations of gas flow and heat transfer in vacuum packaged MEMS devices

Applied Thermal Engineering

Volumn 27, Issue 2-3, 2007, Pages 323-329

  Liu, Hongwei ^a   Wang, Moran ^b   Wang, Jinku ^c   Zhang, Guoyan ^a   Liao, Huailin ^a   Huang, Ru ^a   Zhang, Xing ^a  

^a PEKING UNIVERSITY   (China)

^b Johns Hopkins University   (United States)

^c TSINGHUA UNIVERSITY   (China)

Author keywords

Chip cooling; Gas flow; Heat transfer; Monte Carlo simulation; Packaged MEMS device

Indexed keywords

CHIP COOLING; GAS FLOW; PACKAGED MEMS DEVICES;

COMPUTER SIMULATION; FLOW OF FLUIDS; HEAT TRANSFER; MONTE CARLO METHODS; PROBLEM SOLVING; TEMPERATURE DISTRIBUTION; THERMAL GRADIENTS; VACUUM;

MICROELECTROMECHANICAL DEVICES;

EID: 33749651002     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2006.08.002     Document Type: Article

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