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Volumn 20, Issue 3, 2005, Pages 558-565

Converter concepts to increase the integration level

Author keywords

Heat conductor converter; Lead frame converter; Power electronic converters; Printed circuit board (PCB)

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MOSFET DEVICES; POWER ELECTRONICS; POWER INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS;

EID: 19144370593     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2005.846555     Document Type: Article
Times cited : (17)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.