An approach to deal with packaging in power electronics

IEEE Transactions on Power Electronics

Volumn 20, Issue 3, 2005, Pages 550-557

  Popović, Jelena ^a   Ferreira, J A ^a  

^a Delft University of Technology ^*  (Netherlands)

Author keywords

Functional elements (FEs) integration level; Packaging elements (PEs) integration level; Power electronic converters; Volumetric packaging efficiency

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; POWER CONVERTERS; POWER INTEGRATED CIRCUITS;

FUNCTIONAL ELEMENTS INTEGRATION LEVEL; PACKAGING ELEMENTS INTEGRATION LEVEL; VOLUMETRIC PACKAGING EFFICIENCY;

POWER ELECTRONICS;

EID: 19144373673     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2005.846554     Document Type: Article

References (20)

1. J. D. Van. Wyk and F. C. Lee, "Power electronics technology at the dawn of the new millennium - status and future," in Proc. IEEE Annu. Power Electronics Specialist Conf., 1999, pp. 46-52.
2. D. C. Hopkins S. C. O. Mathuna A. N. Alderman and J. Flannery, "A framework for developing power electronics packaging," in Proc. IEEE APEC'98, vol. 1, 1998 pp. 9-15.
3. International Microelectronics and Packaging Society. (2004). Tech. Rep. [Online] Available: www.imaps.org
4. IEEE Power Electronics Society. (2004). Tech, Rep. [Online] Available: www.pels.org
5. J. D. yan Wyk et al., "The development of planar high density hybrid integration technologies for power electronics," in Proc. EPE-PEMC'02, 2002, pp. 1-14.
6. J. Popovic, J. A. Ferreira, and F. B. M. Van Horck, "Evaluating packaging effectiveness in power electronics," in Proc. 34th Annu. Power Electronics Specialists Conf., vol. 2, Jun. 15,-19, 2003 pp. 881-886.
7. G. R. Blackwell, The Electronic Packaging Handbook. Boca Raton, FL: CRC, 2000.
8. S. French, Decision Theory an Introduction to the Mathematics of Rationality. New York: Ellis Horwood, 1993.
9. F. C. Lee, J. D. van Wyk, D. Boroyevich, and P. Barbosa, "An integrated approach to power electronics System' in Proc: Power Conversion Conf., vol. 1, 2002, pp. 7-12.
10. E. Waffenschmidt and J. A. Ferreira, "Embedded passive integrated circuits for power converter," in Proc. IEEE PESC'02, vol. 1, 2002, pp. 12-17.
11. P. Huber and M. Mills, "Packing power," Digital Power Rep., vol. 3, no. 4, pp. 1-8, Apr. 2002.
12. U. Scheuermann and W. Tursky, "Module integration - challenges and opportunities," in Proc. Power Electronics Eur., May 2003, pp. 13-16.
13. W. D. Brown, Advanced Electronic packaging (With Emphasis on Multichip Modules). Piscataway, NJ: IEEE Press, 1999.
14. D. Giacomini, E. Bianconi, L. Martino, and M. Palma, "A new fully integrated power module for three-phase servo motor drive applications," in Proc. IEEE Industry ApplicatiOns Conf., vol. 2, Oct. 2001, pp. 981-987.
15. Powerex Power Semiconductors. (2004). Tech. Rep. [Online] Available www.pwrx.com
16. H. Iwamoto, E. Motto, J. Achhammer, M. Iwasaki, M. Seo, and T. Iwagami, "New intelligent power modules for appliance motor control," in Proc. Applied Power Electronics Conf. Expo, vol. 2, 2001, pp. 1051-1056.
17. I. W. Hofsajer, J. A. Ferreira, and J. D. Van Wyk, "A new manufacturing and packaging technology for the integration of power electronics," in Proc. 30th IEEE IAS Annu. Meeting Industry Applications Conf., vol. 1, Oct. 1995, pp. 891-897.
18. M. Gerber, J. A. Ferreira, and I. W. Hofsajer, "A volumetric optimization of a low-pass filter," IEEE Trans. Ind. Applicat., vol. 38, no 5, pp. 1432-1440, Sep./Oct. 2002.
19. M. Gerber, J. A. Ferreira, I. W. Hofsajer, and N. Seliger, "High density packaging of the passive component in an automotive DC/DC converter," in Proc. 33rd Annu. Power Electronics Specialists Conf., vol 2, Jun. 23-27, 2002, pp. 761-767.
20. J. Popovic and J. A. Ferreira, "Converter Concepts to increase the integration level," IEEE Trans. Power Electron., vol. 20, no. 3 pp. 558-565 May 2005.