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Volumn 95, Issue 6, 2004, Pages 425-432
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Microstructural evolution and its effect on the mechanical properties of Cu-Ag microcomposites
a
IFW DRESDEN
(Germany)
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Author keywords
Cu Ag alloys; Deformation; Mechanical properties; Microstructure
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Indexed keywords
AGE HARDENING;
COMPOSITION;
COPPER ALLOYS;
DEFORMATION;
DISLOCATIONS (CRYSTALS);
ELECTRIC CONDUCTIVITY;
EUTECTICS;
GRAIN BOUNDARIES;
MAGNETISM;
MICROSTRUCTURE;
PRECIPITATION (CHEMICAL);
SILVER;
SOLID SOLUTIONS;
SOLIDIFICATION;
SUPERCONDUCTIVITY;
TENSILE STRENGTH;
CU-AG ALLOYS;
HOMOGINIZATION;
MICROCOMPOSITES;
PHASE-BOUNDARY HARDENING;
COMPOSITE MATERIALS;
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EID: 3042598992
PISSN: 00443093
EISSN: None
Source Type: Journal
DOI: 10.3139/146.017986 Document Type: Article |
Times cited : (46)
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References (21)
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