Temperature-compensated devices using thin TeO2 layer with negative TCD

IEEE Electron Device Letters

Volumn 27, Issue 9, 2006, Pages 752-754

  Dewan, Namrata ^a   Sreenivas, K ^a   Gupta, Vinay ^a  

^a UNIVERSITY OF DELHI   (India)

Author keywords

Elastic constants; Surface acoustic wave (SAW) device; Temperature coefficient of delay (TCD); TeO2

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; NEGATIVE TEMPERATURE COEFFICIENT; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTING TELLURIUM COMPOUNDS;

ELASTIC CONSTANT; TEMPERATURE COMPENSATION;

THIN FILM DEVICES;

EID: 33748518396     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2006.880644     Document Type: Article

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