Inkjet assisted spray cooling of electronics

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 119-127

  Bash, Cullen E ^a   Patel, Chandrakant D ^a   Sharma, Ratnesh K ^a  

^a HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Electronics cooling; Evaporative spray cooling; Thermal inkjet technology; Thermal management

Indexed keywords

COMPUTATIONAL GEOMETRY; ELECTROHYDRODYNAMICS; FLOW INTERACTIONS; HEAT FLUX; HEAT LOSSES; HEAT TRANSFER COEFFICIENTS; MICROPROCESSOR CHIPS; NOZZLES; SPRAYING; THERMOELECTRIC REFRIGERATION; VOLUME MEASUREMENT; COOLING; DIES; ELECTRONICS PACKAGING; LAKES; SPRAY STEELMAKING; TECHNOLOGY; TEMPERATURE CONTROL; THERMAL PRINTING;

ELECTRONICS COOLING; FLOW RATES; SPRAY COOLING; THERMAL INKJET TECHNOLOGY; THERMAL MANAGEMENT; CRITICAL HEAT FLUX; DENSE CORE; DIE SURFACE; EVAPORATIVE SPRAY COOLING; EXPERIMENTAL DATA; FEATURE SIZES; HEAT SOURCES; HIGH POWER DENSITY; NONUNIFORM; POOL BOILING; POWER DENSITIES; POWER DISSIPATION; PROCESS IMPROVEMENT; PROCESSING CORE; SPRAY DROPLET; SPRAY PATTERN; THERMAL PERFORMANCE;

EVAPORATIVE COOLING SYSTEMS; ELECTRIC LOSSES;

EID: 1242264426     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35058     Document Type: Conference Paper

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