Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1679-1684

  Yuan, C ^a   van Driel, W D ^a,b   van Silfhout, R ^c   van der Sluis, O ^c   Engelen, R A B ^c   Ernst, L J ^b   van Keulen, F ^b   Zhang, G Q ^a,b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DELAMINATION; FAILURE ANALYSIS; STRESS ANALYSIS; THIN FILMS;

DELAMINATION ANALYSIS; LOW-K MATERIALS; THIN-FILM FABRICATION; WARPAGE;

CHEMICAL MECHANICAL POLISHING;

EID: 33748077785     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.054     Document Type: Article

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