High frequency loss and electromagnetic field distribution for striplines and microstrips

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 1, 1999, Pages 16-25

  Louis Lo, H ^a,b   Frank Kauffman, J ^a,b   Franzon, Paul D ^a,b  

^a TYCO TELECOMMUNICATIONS   (United States)

^b North Carolina State University   (United States)

Author keywords

Finite element method; Measured equation of invariance; Microstrip; Multichip module; Package design; Propagation mode; Triplate strip

Indexed keywords

EID: 33748000263     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.746538     Document Type: Article

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