Effects of Polymer/Metal Interaction in Thin-Film Multichip Module Applications

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 4, 1990, Pages 766-774

  Adema, Gretchen M ^a   Turlik, Iwona ^a   Hwang, Lih Tyng ^a   Rinne, Glenn A ^a   Berry, Michele J ^a  

^a MCNC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POLYIMIDES--METALLIZING; POLYMERS--METALLIZING;

METALLIZATION STRUCTURES; MOLECULAR STRUCTURES; POLYMER/METAL INTERACTION; THIN FILM MULTICHIP MODULES;

SOLID STATE DEVICES, THIN FILM;

EID: 0025566479     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.62591     Document Type: Article

References (7)

1. J. J. H. Reche, “High density multichip interconnect for advanced packaging,” in Proc. NEPCON West, Mar. 1989, pp. 1308–1318.
2. S. P. Kowalczyk, Y. H. Kim, G. F. Walker, and J. Kim “Polyimide on copper: The role of solvent in the formation of copper precipitates,” Appl. Phys. Lett., vol. 52, no. 5, pp. 375–376, Feb. 1988.
3. K. Miyazaki, O. Miura, and S. Numata, “Studies on interaction of polyimide with copper in curing process,” in Proc. ECS Fall Meeting, 1988, pp. 296–297.
4. Y.-H. Kim, J. Kim, G. F. Walder, C. Feger, and S. P. Kowalczyk, “Adhesion and interface investigation of polyimide on metals,” J. Adhesion Sci. Technol., vol. 2, no. 2, pp. 95–105, 1988.
5. R. E. Flutie, in Proc. Materials Research Society Symp., 1986, vol. 62.
6. G. J. Dishon, S. M. Bobbio, T. G. Tessier, Y.-S. Ho, and R. Jewett, “High rate magnetron RIE of thick polyimide films for advanced computer applications,” J. Electron. Mat., vol. 18, no. 2, 1989.
7. S. K. Jones, R. C. Chapman, G. Dishon, and E. K. Pavelchek, “Image reversal and lift-off: A versatile combination for ULSI processing,” in Proc. Eighth Int. Technical Conference on Photopolymers (SPE), Oct. 1988, pp. 279–291.