Passivation Schemes for Copper/Polymer Thin-Film Interconnections Used in Multichip Modules

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 1, 1993, Pages 53-59

  Adema, Gretchen M ^a   Hwang, Lih Tyng ^a   Rinne, Glenn A ^a   Turlik, Iwona ^a  

^a MCNC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DIELECTRIC FILMS; MODULAR CONSTRUCTION; PASSIVATION; POLYMERS; THIN FILMS;

INTERCONNECTIONS; MULTICHIP MODULES;

ELECTRONIC EQUIPMENT;

EID: 0027543093     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.214860     Document Type: Article

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