Improved physical understanding of intermittent failure in continuous monitoring method

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1886-1891

  Filho, W C Maia ^a,b   Brizoux, M ^a   Fremont H ^b   Danto, Y ^b  

^a Engineering and Process Management   (France)

^b UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CONDITION MONITORING; CRACK PROPAGATION; ELECTRIC RESISTANCE; ELECTRONIC PROPERTIES; EQUIPMENT TESTING; PRODUCT LIABILITY; RELIABILITY; SAMPLING; SOLDERED JOINTS;

ELECTRIC CONTACT THEORY; ELECTRONIC INTERCONNECTS; IN-SITU MONITORING METHODS; SIGNAL ANALYSIS;

ELECTRONIC EQUIPMENT;

EID: 33747774137     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.086     Document Type: Article

References (9)

1. IPC-SM-785 - Guidelines for Accelerated Rel. Testing of Surface Mount Solder Attachments. IPC. Nov. 1992.
2. Brizoux M, et al. Continuous Monitoring Test. Design for Reliability in a Lead-Free world. NPL, Teddington, UK. January 2002.
3. Dunwoody S, Bock E, Sophia J. A Practical and Reliable Method for Detection of Nanosecond Intermittency. 20th Annual Connector and Interconnection Symposium, San Jose, USA. 1995.
4. Engelmaier W. Detecting Interconnect Failures. Global SMT & Packaging 3 1 (2003)
5. Stepniak F. Failure criteria of flip chip joints during accelerated testing. Microelectronics Reliability 42 (2002) 1921-1930
6. Bartelo J. Thermomechanical Fatigue Behavior of Selected LF Solders. IPC APEX 2001.
7. Suhling JC, et al. Thermal Cycling Reliability of Lead Free Solders for Automotive Application. 2004 Ubter Society Conference on Thermal Phenomena. 2004;350-357.
8. Holm R. Electric Contacts Handbook (1958), Springer-Verlag, Berlin
9. Maia W., Frémont H., Brizoux M., and Danto Y. Solder Joint Loading Conditions under Torsion Test. Eurosime (2006)