Solder joint loading conditions under torsion test

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Maia Filho, Wilson Carlos ^a,b   Brizoux, Michel ^a   Fremont, Hélène ^b   Danto, Yves ^b  

^a THALES RESEARCH AND TECHNOLOGY   (France)

^b UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

BGA solder joints; Finite element analysis; Strain gages; Test methodology; Torsion test

Indexed keywords

DYNAMIC LOADS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; STRAIN GAGES; THERMAL CYCLING; TORSION TESTING;

ACCELERATED THERMAL CYCLING (ATC); BGA SOLDER JOINTS; TEST METHODOLOGY; TORSION TEST;

SOLDERED JOINTS;

EID: 33847169531     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644009     Document Type: Conference Paper

References (4)

1. Dickinson, Gerard T. et al., "Circuit board assembly torsion tester and method," United States Patent, Patent number 5,567,884, Oct.22, 1996.
2. Pang, John H. L. et al, "Mechanical Deflection System (MDS) Test and Methodology for PBGA Solder Joint Reliability," IEEE Transactions on Advanced Packaging. Vol. 24, No. 4 (2001), pp. 507-514.
3. Daya Perera, U., "Evaluation of reliability of μBGA solder joints through twisting and bending," Microelectronics Reliability, No. 39 (1999), pp. 391-399.
4. Engelmaier, Werner. "Reliability of lead-free (LF) solder joints revisited." Global SMT & Packaging, No. 3-8 (2003). pp. 33-34.