The impact of thermal contact conductance on the spreading and solidification of a droplet on a substrate

Heat Transfer Engineering

Volumn 27, Issue 9, 2006, Pages 68-80

  Wang, W ^a   Hong, F J ^a   Qiu, H H ^a   Cheng, P ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; HEAT CONDUCTION; SOLIDIFICATION; THERMAL EFFECTS;

DROPLETS; MOLTEN DROPLET; THERMAL CONTACT;

DROP FORMATION;

EID: 33747619133     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630600846158     Document Type: Conference Paper

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