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Volumn 45, Issue 10, 2002, Pages 2043-2053
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Interfacial thermal conductance in rapid contact solidification process
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Author keywords
Solidification; Temperature measurement; Thermal conductance
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Indexed keywords
COMPUTER SIMULATION;
COPPER;
LIQUID METALS;
SOLIDIFICATION;
SUBSTRATE SURFACE;
THERMAL CONDUCTIVITY;
CONDUCTION;
EXPERIMENTAL MEASUREMENT;
SOLIDIFICATION;
TEMPERATURE;
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EID: 0037128901
PISSN: 00179310
EISSN: None
Source Type: Journal
DOI: 10.1016/S0017-9310(01)00307-6 Document Type: Article |
Times cited : (26)
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References (24)
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