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Volumn 45, Issue 10, 2002, Pages 2043-2053

Interfacial thermal conductance in rapid contact solidification process

Author keywords

Solidification; Temperature measurement; Thermal conductance

Indexed keywords

COMPUTER SIMULATION; COPPER; LIQUID METALS; SOLIDIFICATION;

EID: 0037128901     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(01)00307-6     Document Type: Article
Times cited : (26)

References (24)
  • 9
    • 0021002408 scopus 로고
    • Transient methods for determination of metal-mold interfacial heat transfer
    • (1983) AFS Trans , vol.91 , pp. 689-698
    • Ho, K.1    Pehlke, R.D.2
  • 20
    • 0000878447 scopus 로고
    • A special thermocouple for measuring transient temperatures
    • (1953) Mech. Eng , vol.75 , Issue.2 , pp. 117-121
    • Bendersky, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.