Transport phenomena in picoliter size solder droplet dispension

Journal of Heat Transfer

Volumn 118, Issue 1, 1996, Pages 148-156

  Wallace, D B ^b   Poulikakos, D ^a,c  

^a 1120 Science and Engineering Offices   (United States)

^b MicroFab Inc   (United States)

^c ETH ZURICH   (Switzerland)

Author keywords

Conjugate Heat Transfer; Liquid metals; Manufacturing processes; Materials processing

Indexed keywords

DROP FORMATION; FINITE ELEMENT METHOD; FLUID DYNAMICS; HEAT TRANSFER; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; NUMERICAL METHODS;

IMPINGEMENT; PICOLITER SIZE SOLDER DROPLETS; SOLDER DISPENSION; SPREADING PROCESS; TRANSIENT TEMPERATURE FIELDS; TRANSPORT PHENOMENA;

SOLDERING ALLOYS;

EID: 0030073530     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2824028     Document Type: Article

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