An investigation of key factors affecting solder microdroplet deposition

Journal of Heat Transfer

Volumn 120, Issue 1, 1998, Pages 259-270

  Xiong, B ^a   Megaridis, C M ^a   Poulikakos, D ^b   Hoang, H ^c  

^a 1120 Science and Engineering Offices   (United States)

^b ETH ZURICH   (Switzerland)

^c MOTOROLA INC   (United States)

Author keywords

Electronic equipment; Liquid metals; Sprays Droplets

Indexed keywords

COMPOSITION EFFECTS; DEPOSITION; HEAT RESISTANCE; MATHEMATICAL MODELS; OXIDATION RESISTANCE; SOLIDIFICATION; THERMAL EFFECTS;

THERMAL CONTACT RESISTANCE;

SOLDERING;

DEPOSITION; DROPLET; SOLIDIFICATION;

EID: 0032004453     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2830051     Document Type: Editorial

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