Packing of submicrometer-sized polystyrene particles within the micrometer-sized recessed patterns on silicon substrate

Science and Technology of Advanced Materials

Volumn 7, Issue 5, 2006, Pages 451-455

  Tanaka, Manabu ^a   Shimamoto, Naonobu ^a   Tanii, Takashi ^a   Ohdomari, Iwao ^a   Nishide, Hiroyuki ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

Capillary force; Cubic packing; Hexagonal closest packing; Polystyrene particle; Self assembly; Silicon microfabricated substrate

Indexed keywords

DEPOSITION; MICROMETERS; PACKING; SILICON; SURFACE STRUCTURE; SURFACE TENSION;

CAPILLARY FORCE; MICROFABRICATED SUBSTRATES; PACKING STRUCTURES; PULLING-UP PROCESS;

POLYSTYRENES;

EID: 33747151907     PISSN: 14686996     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.stam.2006.04.003     Document Type: Article

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