Mechanical properties of helically perforated thin films

Journal of Materials Research

Volumn 21, Issue 5, 2006, Pages 1101-1105

  Fernando, Sumuhu P ^a   Elias, A L ^a   Brett, M J ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; INDENTATION; NANOSTRUCTURED MATERIALS; SEMICONDUCTOR DEVICE MANUFACTURE;

HELICALLY PERFORATED THIN FILMS; NANOINDENTATION MEASUREMENT; PITCH ANGLE;

THIN FILMS;

EID: 33746513348     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0160     Document Type: Article

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