Mechanical properties of Au thin film for application in MEMS/NENS using microtensile test

Current Applied Physics

Volumn 6, Issue SUPPL. 1, 2006, Pages

  Han, S W ^a   Lee, H W ^b   Lee, H J ^a   Kim, J Y ^a   Kim, J H ^a   Oh, C S ^c   Choa, S H ^d  

^a Korea Institute of Machine and Materials   (South Korea)

^b Pusan National University   (South Korea)

^c Kumoh National Institute of Technology   (South Korea)

^d Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Au thin films; Mechanical properties; Microtensile test; Nanoindentation

Indexed keywords

GOLD COMPOUNDS; INDENTATION; IONS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; NANOTECHNOLOGY; STRAIN MEASUREMENT; TENSILE TESTING;

AU THIN FILMS; MICROTENSILE TEST; NANOINDENTATION; STRESS-STRAIN CURVE;

THIN FILMS;

EID: 33746266666     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2006.01.017     Document Type: Article

References (8)

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