Bulge test on free standing gold thin films

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 437-442

  Li, Yawen ^a   Cima, Michael J ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; EVAPORATION; GOLD; INTERFEROMETRY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NITRIDES; PLASMA ETCHING; PRESSURE EFFECTS;

BIAXIAL MODULUS; BULGE TESTING; GOLD FILMS; MICROFABRICATION PROCESSES;

THIN FILMS;

EID: 2442432483     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u10.3     Document Type: Conference Paper

References (8)

1. R. J. Hohlfelder, Doctoral Thesis, Stanford University, (1998).
2. M. K. Small, Doctoral Thesis, Stanford University, (1993).
3. J. J. Vlassak, Doctoral Thesis, Stanford University, (1994).
4. J. T. Santini, Jr., M. J. Cima and R. Langer, Nature 397, 335-338 (1999).
5. ASM Handbook Vol.2, ed. S. Lapman, (ASM International, 1990), p. 704.
6. R.D. Emery and G.L. Povirk, Acta Mater. 51 2079-2087 (2003)
7. W. N. Sharpe, Jr., "Mechanical Properties of MEMS Materials," The MEMS Handbook, ed. M. Gad-el-Hak (CRC Press, 2001) pp. 3-1-3-33.
8. R. W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials, John Wiley and Sons, New York, (1989) p. 153