Modeling of micro spring tension force for vertical type probe card fabrication

Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)

Volumn 3973 LNCS, Issue , 2006, Pages 976-981

  Min, Chul Hong ^a   Kim, Tae Seon ^a  

^a The Catholic University of Korea   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; NEURAL NETWORKS; PROBES; RELIABILITY; STATISTICAL METHODS; TESTING;

MICRO SPRING MODEL; PROBE TESTING PERFORMANCE; TENSION FORCE;

SPRINGS (COMPONENTS);

EID: 33745892063     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: 10.1007/11760191_143     Document Type: Conference Paper

References (5)

1. http://www.jem-net.co.jp/en/products/pro_han_kpc.html
2. Iwai, H., Nakayama, A., Itoga, N., Omata, K.: Cantilever type probe card for at-speed memory test on wafer. VLSI Test Symposium IEEE, May (2005)85-89
3. Kim, Y.M., Yoon, H.C., Lee, J.H.: Silicon Micro-probe Card Using Porous Silicon Micro-machining Technology. ETRI Journal 8(2005)433-438
4. Itoh, T., Kawamura, S., Kataoka, K., Suga, T.: Contact Properties of Micromachined Ni Probes. Proceedings of the Forty-Ninth IEEE Holm Conf. (2003) 223-227
5. Tracy, N.L., Rothenberger, R., Copper, C., Corman, N., Biddle, G., Matthews, A., McCarthy, S.: Array sockets and connectors using MicroSpringTM technology. Electronics Manufacturing Technology Symposium, Twenty-Sixth IEEE/CPMT International, (2000) 129-140