Development of high power press-pack IGBT and its applications

2000 22nd International Conference on Microelectronics, MIEL 2000 - Proceedings

Volumn 1, Issue , 2000, Pages 125-129

  Uchida, Yoshiyuki ^a   Seki, Yasukazu ^a   Takahashi, Yoshikazu ^a   Ichijoh, Masami ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DRIVES; METAL STAMPING; MICROELECTRONICS; STRUCTURE (COMPOSITION); INSULATED GATE BIPOLAR TRANSISTORS (IGBT); ELECTRIC TRACTION; ELECTRONICS PACKAGING; POWER INTEGRATED CIRCUITS; POWER TRANSMISSION; RELIABILITY; THYRISTORS;

HIGH POWER; HIGH RELIABILITY; IGBT DEVICES; IGBT-MODULES; INDUSTRIAL MOTOR; ITS APPLICATIONS; PRESS PACK; INDUSTRIAL MOTOR DRIVE; INSULATED GATE BIPOLAR TRANSISTOR;

PRESSES (MACHINE TOOLS); BIPOLAR TRANSISTORS;

EID: 33745753325     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMEL.2000.840538     Document Type: Conference Paper

References (7)

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2. M. Hiyoshi, "A 1000A 2500V Pressure Mount RC-IGBT", Proc.ofEPE'95, ppl.051(1995)
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5. T. Koga, K. Yamazaki JI. Wakimoto, Y. Takahashi JI. Kirihata and Y. Seki,"Ruggedness and Reliability of the 2.5kV-1.8kA Power Pack IGBT with a Novel Multi-Collector Structure", Proc.of ISPSD'98, pp.437 (1998)
6. Y. Takahashi, K. KogaJf C. Yoshikawa, K. Yamazaki, M. Ichijoh and Y. Seki,"4.5kV-1200A Power Pack IGBT', Proc.of PCM 99, PCI,(1999)
7. K. Yoshikawa, " T. Koga, T. Fujii, T. Katoh, Y. Takahashi and Y. Seki ,"A Novel IGBT Chip Design Concept of High Turn-off Current Capability and High Short Circuit Capability for 2.5kV Power Pack IGBT", Proc. oflSPSD '99, pp.177,(1999)