Analysis of Cu/low-k bond pad delamination by using a novel failure index

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 190-196

  Van Gils, M A J ^a   Van Der Sluis, O ^a   Zhang, G Q ^a   Janssen, J H J ^b   Voncken, R M J ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CMOS INTEGRATED CIRCUITS; DELAMINATION; FAILURE ANALYSIS; METAL MOLDING; OPTIMIZATION; WIRE;

IC BACK END STRUCTURE; INTERFACIAL ADHESION; THERMO MECHANICAL RELIABILITY; WIRE BONDING;

BEARING PADS;

EID: 33745683903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502798     Document Type: Conference Paper

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