Probability of silicon fracture in molded packages

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 75-81

  Bohm, Christina ^a   Hauck, Torsten ^a   Müller, Wolfgang H ^b   Juritza, A ^b  

^a Motorola GmbH   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE PROBABILITY; MOLDED PACKAGES; SILICON FRACTURE; WEIBULL THEORY;

ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FRACTURE MECHANICS; GEOMETRY; MICROPROCESSOR CHIPS; MOLDING; PROBABILITY; STRENGTH OF MATERIALS; THERMAL EFFECTS;

SEMICONDUCTING SILICON;

EID: 3843090529     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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10. T. Hauck, "Bruchmechanische Bewertung thermisch eigengespannter Grenzflächenrisse in elastoplastischen Bimaterialien," Dissertation Gesamthochschule Paderborn, 1997