Post-etch LER performance of novel surface conditioner solutions

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 II, Issue , 2006, Pages

  Zhang, P ^a   Jaramillo, M ^a   Cassel, S ^a   Wallow, T ^b   Acheta, A ^b   Pawloski, A R ^b   Bell, S ^b   Kim, R H ^b  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

Hard bake; Line edge roughness; Post etch LER; Surface conditioner

Indexed keywords

HARD BAKE; LINE EDGE ROUGHNESS; POST-ETCH LER; SURFACE CONDITIONER;

DATA REDUCTION; ETCHING; OPTICAL ENGINEERING; OPTICAL MATERIALS; SURFACE PROPERTIES;

SURFACE ROUGHNESS;

EID: 33745596834     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656648     Document Type: Conference Paper

References (6)

1. The International Technology Roadmap for Semiconductors, Lithography Section (San Jose: Semiconductor Industry Association, 2003).
2. a) P. Zhang, M. Jaramillo, Jr.; M. B. Rao, C. Yates, D. M. King, B. F. Ross, B. L. O'Brien, Proc. SPIE 2004, 5376, 801-806.
3. b) P. Zhang et al. SPIE Proceedings, 2005, 5753, 1018-1024.
4. B. Rice et al. SPIE Proceedings, 2003, 5039, 384-392.
5. A. Pawloski et al., SPIE Proceedings, 2004, 5376, 414-425.
6. A. Pawloski et al. SPIE Proceedings, 2006, in press.