A FEM/VOF hybrid formulation for underfill encapsulation modeling

Computers and Structures

Volumn 81, Issue 8-11, 2003, Pages 879-885

  Pantuso, Daniel ^a   Jiang, Lei ^a   Shankar, Sadasivan ^a   Skokov, Sergei ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Encapsulation; Finite elements; Flip chip; Hele Shaw; Underfill; Volume of fluid

Indexed keywords

COMPUTER SIMULATION; ENCAPSULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RHEOLOGY;

UNDERFILL ENCAPSULATION PROCESSES;

ELECTRONICS PACKAGING;

EID: 0037401881     PISSN: 00457949     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0045-7949(02)00419-4     Document Type: Article

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