Flow analysis in a chip cavity during semiconductor encapsulation

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 160-167

  Han, S ^a   Wang, K K ^a  

^a Cornell University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042280621     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483149     Document Type: Article

References (12)

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3. Nguyen, N. 1994, “Flow Simulation in IC Chip Encapsulation,” Electronic Component and Technology Conference, Buena Vista, FL.
4. Bird, R. B., Armstrong, R. C., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1, Wiley-Interscience, New York.
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7. Tucker, C. L., 1987, Injection and Compression Molding Fundamentals, A. I. Isayev, ed., Chap. 7, Marcel Dekker, New York.
8. Gupta, M., 1995, “Juncture Loss in an Entrance Region for Polymeric Materials,” SPE Tech. Pap., Vol. 1, pp. 774-778.
9. Gibson, A. G., 1988, Rheological Measurement, A. A. Collyer, and D. W. Clegg, eds., Chap. 3, Elsevier Applied Science, New York.
10. Han, S., Wang, K. K., Hieber, C. A., and Cohen, C., 1997, “Characterization of the Rheological Properties of a Fast-Curing Epoxy Molding Compound,” J. Rheol., 42, pp. 177-195.
11. Castro, J. M., and Macosko, C. W., 1980, “Kinetics and Rheology of Typical Polyurethane Reaction Injection Molding Systems,” SPE Tech. Pap., 26, pp. 434-438.
12. Karnal, M. R., and Ryan, M. E., 1987, Injection and Compression Molding Fundamentals, A. I. Isayev, ed., Chap. 4, Marcel Dekker, New York.