Metal foundation construction to consolidate electroplated structures for successful removal of SU-8 mould

Electronics Letters

Volumn 42, Issue 12, 2006, Pages 690-691

  Cui, F ^a   Chen, W Y ^a   Zhao, X L ^a   Jing, X M ^a   Wu, X S ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRODEPOSITION; ELECTRODES; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MICROSTRUCTURE; NICKEL; THIN FILM DEVICES; WSI CIRCUITS;

FUMING SULPHURIC ACID OXIDISING METHOD; INTERLEVEL DIELECTRIC; ROTATIONAL MICROGYRO; SU-8 MOULD;

ELECTROPLATED PRODUCTS;

EID: 33745087557     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20060751     Document Type: Article

References (4)

1. Dentigenger, P.M., Clift, W.M., and Goods, S.H.: ' Removal of SU-8 photoresist for thick applications ', Microelectron. Eng., 2002, 61-62, p. 993-1000
2. Ho, C.H., and Hsu, W.: ' Experimental investigation of an embedded root method for stripping SU-8 photoresist in the UV-LIGA process ', J. Micromech. Microeng., 2004, 14, p. 356-364
3. Cui, F., and Chen, W.Y.: et al. ' Design of electrostatically levitated micromachined rotational gyroscope based on UV-LIGA technology ', Proc. SPIE 'MEMS/MOEMS Technologies and Applications II', November 2004, 5641, p. 264-275 Beijing
4. Andricacos, P.C., Uzoh, C., and Dukovic, J.O.: et al. ' Damascene copper electroplating for chip interconnections ', IBM J. Res. Dev., 1998, 42, p. 567-574