Performance of low cost PBGA package for 10Gb/s applications

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 71-74

  Zhou, Xingling ^a   Fang, Nancy J ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

10 GB/ S; ELECTRICAL CHARACTERIZATION; LOW COSTS; PACKAGING SOLUTIONS; PLASTIC BALL GRID ARRAYS; SONET/SDH;

PACKAGING;

EID: 33751028106     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057886     Document Type: Conference Paper

References (4)

1. M. Megahed, P. Zilaro and M. Khaw, "Design and Analysis of Low Cost IC Package Solution for 10 Gbit/s Applications," 2001 IEEE MTT-S Digest, pp.1899-1902,2001.
2. M. Wang, A. Langari and H. Hashemi, "Advanced Packaging for GHz Switching Applications," 2002 Electronic Components and Technology Conference, pp.634-640.
3. W. Xie, X. Zhou, D. Gerlach and N. Fang, "Manufacturing Variation on lOGb/s PBGA Performance," Agere Systems, to be published.
4. Ansofi Corporation, Pittsburgh, Pennsylvania.