Package compatibility and substrate dependence of granular soft magnetic material CoFeHfO developed by reactive sputtering

Journal of Applied Physics

Volumn 99, Issue 8, 2006, Pages

  Li, Liangliang ^a   Wang, Shan X ^a   Hwang, Kyu Pyung ^b   Min, Yongki ^b   Mao, Ming ^c   Schneider, Thomas ^c   Bubber, Randhir ^c  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

^c VEECO INSTRUMENTS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COFEHFO THIN FILMS; PACKAGE SUBSTRATE; REACTIVE SPUTTERING; SURFACE PLANARIZATION;

ATOMIC FORCE MICROSCOPY; CRYSTAL MICROSTRUCTURE; GRANULAR MATERIALS; PRINTED CIRCUIT BOARDS; THIN FILMS; X RAY DIFFRACTION;

SOFT MAGNETIC MATERIALS;

EID: 33646797102     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2158973     Document Type: Article

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