Direct fabrication of electric components on insulated boards by laser microcladding electronic pastes

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 2, 2006, Pages 291-294

  Zeng, Xiaoyan ^a   Li, Xiangyou ^a   Liu, Jingwei ^a   Qi, Xiaojing ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Circuit board fabrication; Laser direct writing; Laser microcladding electronic pastes; Silver conductors

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED MANUFACTURING; ELECTRIC CONDUCTORS; LASER APPLICATIONS; MICROELECTRONIC PROCESSING; PRINTED CIRCUIT BOARDS; SILVER; SUBSTRATES;

CIRCUIT BOARD FABRICATION; INSULATED BOARDS; LASER DIRECT WRITING; LASER MICROCLADDING ELECTRONIC PASTES; SILVER CONDUCTORS;

ELECTRONICS PACKAGING;

EID: 33646496323     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.853546     Document Type: Article

References (27)

1. V. Kripesh, W. Gust, and S. K. Bhatnagar et al., "Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates," Mater. Lett., vol. 44, no. 6, pp. 347-351, 2000.
2. M. J. Ehlin, "High speed photoresists for laser direct imaging," Printed Circuit Fabrication, vol. 21, no. 7, pp. 40-48, 1998.
3. C. L. Chen, G. J. Black, and L. J. Mahoney et al., "GaAs monolithic microwave integrated circuit trimming using laser-direct-written tungsten microstrip lines," Electron. Lett., vol. 23, no. 8, pp. 402-403, 1987.
4. M. Meunier, R. Izquierdo, and P. Desjardins et al., "Laser direct writing of tungsten from WF6," Thin Solid Films, vol. 218, pp. 137-143, 1992.
5. H. Moilanen, J. Remes, and S. Leppavuori, "Low resistivity LCVD direct write Cu conductor lines for IC customization," Phys. Scipta T, vol. 69, pp. 237-241, 1997.
6. R. F. Terrill, K. H. Church, and M. Moon, "Laser chemical vapor deposition for microelectronics production," in Proc. IEEE Aerospace Applications Conf., vol. 1, 1998, pp. 377-382.
7. C. Popov et al., "Laser-induced chemical vapor deposition of aluminum from trimethylamine alane," J. Appl. Phys., vol. 75, pp. 3687-3689, 1994.
8. K. Kordás, K. Bali, and S. Leppävuori et al., "Laser direct writing of copper on polyimide surfaces from solution," Appl. Surf. Sci., vol. 154-155, pp. 399-404, 2000.
9. K. Kordás, K. Bali, and S. Leppävuori et al., "Laser direct writing of palladium on polyimide surfaces from solution," Appl. Surf. Sci., vol. 152, pp. 149-155, 1999.
10. O. Lehmann and M. Stuke, "Laser-driven movement of three-dimensional microstructures generated by laser rapid prototyping," Science, vol. 270, pp. 1644-1646, 1995.
11. H. G. Muller, "YAG laser direct writing of copper from copper formate films," Appl. Phys. Lett., vol. 56, pp. 904-906, 1990.
12. H. W. Lee and S. D. Allen, "High deposition rate laser direct writing of Al on Si," Appl. Phys. Lett., vol. 58, pp. 2087-2089, 1991.
13. Y. Sato et al., "Laser-enhanced palladium electroless plating," Trans. Inst. Metal Fishing, vol. 75, pp. 4-6, 1997.
14. G. A. Shafeev, "Laser-assisted activation of dielectrics for electroless metal plating," Appl. Phys. A: Mater. Sci. Process., vol. A67, pp. 303-311, 1998.
15. S. Z. Chu et al., "Local deposition of Ni-P alloy on aluminum by laser irradiation and electroless plating," J. Electrochem. Soc., vol. 146, pp. 537-546, 1999.
16. N. P. Suh et al., "Method for forming electrically conductive paths," U.S. Patent 4 159 414, 1979.
17. P. Soszek, " Method for manufacturing a circuit board," U.S. Patent 4710 253, Dec. 1, 1987.
18. K. W. Beeson et al., "Fast photolytic laser writing of gold lines on a prenucleated substrate," Appl. Phys. Lett., vol. 53, pp. 547-549, 1988.
19. K. Bali et al., "Organic solutions of triphenylphosphine gold complexes: Attractive new candidates for gold deposition," Mater. Sci. Eng., vol. B17, pp. 101-103, 1993.
20. A. J. Castro et al., "Laser direct writing," U.S. Patent 5 378 508, Jan. 3, 1995.
21. A. J. Weigel et al., " Laser write process for making a conductive metal circuit," U.S. Patent 5 576 074, Nov. 19, 1996.
22. S. Maruyama et al., "Method of modifying conductive lines of electronic circuit board and its apparatus," U.S. Patent 5 832 595, 1998.
23. H. Hidai and H. Tokura, "Direct laser writing of aluminum and copper on glass surfaces from metal powder," Appl. Surf. Sci., vol. 174, pp. 118-124, 2001.
24. D. B. Chrisey, A. Pique, R. Modi, H. D. Wu, R. C. Y. Auyeung, and H. D. Young, "Direct writing of conformal mesoscopic electronic devices by MAPLE DW," Appl. Surf. Sci., vol. 168, pp. 345-352, 2000.
25. D. B. Chrisey, A. Pique, J. Fitz-Gerald, R. C. Y. Auyeung, R. C. Y. Auyeung, R. A. MiGill, H. D. Wu, and M. Duignan, "New approach to laser direct writing active and passive mesoscopic circuit elements," Appl. Surf. Sci., vol. 154-155, pp. 593-600, 2000.
26. D. Young, R. C. Y. Auyeung, A. Pique, D. B. Chrisey, and D. D. Dlott, "Plume and jetting regimes in a laser based forward transfer process as observed by time-resolved optical microscopy," Appl. Surf. Sci., vol. 197-198, pp. 181-187, 2002.
27. K. Pitt, Handbook of Thick Film Technology, 2nd ed. Isle of Man, U.K.: Electrochemical Publ. Ltd., 2002, p. 129.