Electrical characterization of quad flat non-lead package for RFIC applications

2001 International Semiconductor Device Research Symposium, ISDRS 2001 - Proceedings

Volumn , Issue , 2001, Pages 266-269

  Chen, Nansen ^a,c   Chiang, K ^a   Her, T D ^a   Lai, Yeong Lin ^b   Chen, Chichyang ^c  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

^b NATIONAL CHANGHUA UNIVERSITY OF EDUCATION   (Taiwan)

^c FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; CIRCUIT THEORY; EQUIVALENT CIRCUITS; RECONFIGURABLE HARDWARE; SCATTERING PARAMETERS; SEMICONDUCTOR DEVICES;

CHIP SIMULATIONS; ELECTRICAL CHARACTERIZATION; EQUIVALENT CIRCUIT MODEL; LEADFRAME SUBSTRATES; PARASITIC PARAMETER; RF APPLICATIONS; S-PARAMETER MEASUREMENTS; SHORT-PATH CONFIGURATIONS;

PARAMETER ESTIMATION;

EID: 84961841567     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISDRS.2001.984492     Document Type: Conference Paper

References (4)

1. Nansen Chen, Kelly Liu, Kevin Chiang, and T.D. Her, "Structure Investigation of Quad Flat Non-lead Package to Improve Radio-Frequency Application," EuroSimE 2001 Conference, April 2001, pp. 137-139.
2. Paul Harvey, Alan Kinningham, and Chris Schmolze, "Electrical Characterization of Tape Ball Grid Array Package," IEPS Conference, September 1995.
3. T.S. Horng, S.M. Wu, J.Y. Li, C.T. Chiu, and C.P. Hung, "Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages," Electronic Components and Technology Conference, 2000, pp. 439-444.
4. Jaeyong Jeong, Seungki Nam, Y. S. Shin, Y. S. Kim, and Jichai Jeong, "Electrical Characterization of Ball Grid Array Packages from S-parameter Measurements Below 500 MHz," IEEE Transactions On Advanced Packaging, Vol. 22, No. 3, Aug. 1999, pp. 343-347.