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Volumn E89-C, Issue 4, 2006, Pages 551-559

Band-stop filter effect of power/ground plane on through-hole signal via in multilayer PCB

Author keywords

Power integrity; Power ground plane; Radiated emission; Return current; Signal integrity; Signal via

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC DISTORTION; MULTILAYERS; RADIATION; RESONANCE; SIGNAL FILTERING AND PREDICTION; SIGNAL PROCESSING; WAVEFORM ANALYSIS;

EID: 33646267181     PISSN: 09168524     EISSN: 17451353     Source Type: Journal    
DOI: 10.1093/ietele/e89-c.4.551     Document Type: Article
Times cited : (10)

References (9)
  • 1
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    • Pak, J.S.1    Kim, J.2
  • 2
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    • Feb.
    • Q. Gu, Y.E. Yang, and M.A. Tassoudji,"Modeling and analysis of vias in multilayered integrated circuits." IEEE Trans. Microw. Theory Tech., vol.41, no.2, pp.206-214, Feb. 1993.
    • (1993) IEEE Trans. Microw. Theory Tech. , vol.41 , Issue.2 , pp. 206-214
    • Gu, Q.1    Yang, Y.E.2    Tassoudji, M.A.3
  • 4
    • 0033310488 scopus 로고    scopus 로고
    • Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination
    • Aug.
    • I. Novak, "Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination," IEEE Trans. Adv. Packag., vol.22, no.3. pp.274-283, Aug. 1999.
    • (1999) IEEE Trans. Adv. Packag. , vol.22 , Issue.3 , pp. 274-283
    • Novak, I.1
  • 5
    • 0033346520 scopus 로고    scopus 로고
    • An investigation of PCB radiated emissions from simultaneous switching noise
    • Seattle, WA, Aug.
    • S. Radu and D. Hockanson, "An investigation of PCB radiated emissions from simultaneous switching noise," Proc. IEEE Int. Symp, Electromagnetic Compatibility, pp.893-898, Seattle, WA, Aug. 1999.
    • (1999) Proc. IEEE Int. Symp, Electromagnetic Compatibility , pp. 893-898
    • Radu, S.1    Hockanson, D.2
  • 6
    • 0042863358 scopus 로고    scopus 로고
    • The radiation of a rectangular power-bus structure at multiple cavity-mode resonances
    • Aug.
    • M. Leone, "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Trans. Electromag. Compat., vol.45, no.3, pp.486-492, Aug. 2003.
    • (2003) IEEE Trans. Electromag. Compat. , vol.45 , Issue.3 , pp. 486-492
    • Leone, M.1
  • 7
    • 0029409390 scopus 로고
    • Modeling and analysis of multichip module power supply planes
    • Nov.
    • K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Adv. Packag., vol.18, no.4, pp.628-639, Nov. 1995.
    • (1995) IEEE Trans. Adv. Packag. , vol.18 , Issue.4 , pp. 628-639
    • Lee, K.1    Barber, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.