RF modeling of vertical interconnection between power-ground plane combined with 2D TLM

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 339-342

  Ito, Ryosuke ^a   Carrillo Ramirez, Rodrigo ^a   Jackson, Robert W ^a  

^a M/A COM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCIES; MATHEMATICAL MODELS; MATRIX ALGEBRA; TRANSMISSION LINE THEORY; TWO DIMENSIONAL;

LUMPED ELEMENT MODEL; POWER GROUND PLANE; TWO DIMENSIONAL TRANSMISSION LINE MATRIX METHOD;

INTERCONNECTION NETWORKS;

EID: 0035703102     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Accurate power supply and ground plane pair models [for MCMs]
2. Modeling of interconnections and isolation within a multilayered ball array package
3. Modeling of electrical properties of power/ground planes in electronics packaging
4. Fullwave analysis of three and four-port rectangular waveguide junctions