Electroplating of lead-free solder alloys composed of Sn-Bi, Sn-Ag, and Sn-Cu

Proceedings of the AESF Annual Technical Conference

Volumn , Issue , 1999, Pages 457-468

  Yanada, Isamu ^a   Gudeczauskas, Donald ^a  

^a Central Research and Development Laboratory   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING SOLUTIONS; ENVIRONMENTAL PROTECTION; METAL MELTING; SOLDERING; SOLDERING ALLOYS; STRENGTH OF MATERIALS; SULFUR COMPOUNDS; TINNING;

METHANESULFONIC ACID; SOLDERABILITY;

ELECTROPLATING;

EID: 0032638566     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)