A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages

Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 57-67

  Kay, N R ^a   Ghosh, S ^a   Guven, I ^a   Madenci, E ^a  

^a University of Arizona   (United States)

Author keywords

DIC; Indirect measurement; Interface fracture parameters

Indexed keywords

BOUNDARY CONDITIONS; CRACKS; DISSIMILAR MATERIALS; FRACTURE; IMAGE PROCESSING; MECHANICAL TESTING; SCANNING ELECTRON MICROSCOPY;

DIGITAL IMAGE CORRELATION; ELECTRONIC PACKAGES; ENERGY RELEASE RATE; INTERFACE FRACTURE PARAMETERS;

INTERFACES (MATERIALS);

BOUNDARY CONDITIONS; CRACKS; DISSIMILAR MATERIALS; FRACTURE; IMAGE PROCESSING; INTERFACES (MATERIALS); MECHANICAL TESTING; SCANNING ELECTRON MICROSCOPY;

EID: 33645950427     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.013     Document Type: Article

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