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Volumn 38, Issue 50-51, 2001, Pages 9077-9109
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Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading
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Author keywords
Dissimilar material junctions; Finite region; Thermal and mechanical loading
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Indexed keywords
ANALYTIC METHOD;
COMPUTER SOFTWARE;
FINITE ELEMENT METHOD;
MATERIAL FORMS AND STATES;
MECHANICAL STRESS;
ONLINE ANALYSIS;
SURFACE PROPERTY;
COMPUTER PROGRAM LISTINGS;
DISSIMILAR MATERIALS;
EIGENVALUES AND EIGENFUNCTIONS;
FINITE ELEMENT METHOD;
THERMAL LOAD;
USER INTERFACES;
SINGULAR STRESS FIELDS;
STRESS ANALYSIS;
ADHESIVE AGENT;
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EID: 0035976657
PISSN: 00207683
EISSN: None
Source Type: Journal
DOI: 10.1016/S0020-7683(01)00206-2 Document Type: Article |
Times cited : (46)
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References (21)
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