Combined circuit-electromagnetic simulation using multiregion time domain integral equation scheme

IEEE Transactions on Electromagnetic Compatibility

Volumn 48, Issue 1, 2006, Pages 2-9

  Yang, Chuanyi ^a   Jandhyala, Vikram ^a  

^a University of Washington   (United States)

Author keywords

Coupled circuit electromagnetic simulation; Electronic package and interconnect modeling; Signal integrity; Time domain integral equation

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRIC CONDUCTORS; ELECTROMAGNETISM; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

COUPLED CIRCUIT-ELECTROMAGNETIC SIMULATION; ELECTRONIC PACKAGE; HIGH-SPEED MICROELECTRONICS; INTERCONNECT MODELING; TIME-DOMAIN INTEGRAL EQUATION;

MICROELECTRONICS;

EID: 33645830072     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2006.870708     Document Type: Article

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