Integral equation based time domain coupled EM-circuit simulation for packaged conductors and dielectrics

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 371-374

  Chuanyi, Yang ^a   Gong, Ouyang ^a   Vikram, Jandhyala ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; ELECTRONICS PACKAGING;

BASIS FUNCTIONS; GAUSSIAN QUADRATURES; MATERIAL EFFECT; NON-UNIFORM MESH; RIGOROUS SIMULATION; SINGULARITY EXTRACTION; TIME DOMAIN INTEGRAL EQUATIONS; TRIANGULAR PATCH;

INTEGRAL EQUATIONS;

EID: 84945250428     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250071     Document Type: Conference Paper

References (6)

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3. A. E. Ruehli, "Equivalent circuit models for three dimensional multiconductor systems IEEE Trans. Microwave Theory Tech., vol. 22, pp. 216-221, Mar. 1974.
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5. S. M. Rao, T, K, Sarkar, "Numerical Solution of Time Domain Integral Equations for Arbitrarily Shaped Conductor/Dielectric Composit Bodies, " IEEE Trans. Antennas Propagat, vol. 50, pp, 1831-1837, Dec. 2002.
6. R. F. Harrington, 'Time-Harmonic Electromagnetic Fields, " New York: McGraw-Hill, 1961.