Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 233-

  Wang, Yong ^a   Jandhyala, Vikram ^a   Shi, C J Richard ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC CONDUCTORS; ELECTRIC NETWORK TOPOLOGY; EQUIVALENT CIRCUITS; INDUCTANCE; INTEGRAL EQUATIONS; NUMERICAL METHODS;

ARBITRARILY-SHAPED CONDUCTING STRUCTURES; COUPLED ELECTROMAGNETIC-CIRCUIT SIMULATION; PARTIAL ELEMENT EQUIVALENT CIRCUIT;

ELECTROMAGNETIC FIELD THEORY;

EID: 0035703754     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Equivalent circuit models for three-dimensional multiconductor systems
2. Design of mixed-signal systems-on-a-chip
3. Electromagnetic scattering by surfaces of arbitrary shape
4. Automatic equivalent discrete distributed circuit generation for microstrip interconnection discontinuities
5. Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation