Development of a spontaneous immersion process for deposition of cerium oxide coatings on copper substrates

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 5733-5737

  Edington, Joe ^a,b   O'Keefe, Matthew J ^a,b   O'Keefe, Thomas J ^a,b  

^a University of Missouri Rolla   (United States)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Cerum oxide; Copper; Immersion process; Spontaneous

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COATING TECHNIQUES; COPPER; CRYSTAL STRUCTURE; ELECTRON DIFFRACTION; HYDROGEN PEROXIDE; METAL FOIL; MORPHOLOGY; OPTIMIZATION; PH; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

CERIUM OXIDE COATINGS; COPPER SUBSTRATES; SPONTANEOUS IMMERSION PROCESS;

CERIUM COMPOUNDS;

AUGER ELECTRON SPECTROSCOPY; CERIUM COMPOUNDS; COATING TECHNIQUES; COPPER; CRYSTAL STRUCTURE; ELECTRON DIFFRACTION; HYDROGEN PEROXIDE; METAL FOIL; MORPHOLOGY; OPTIMIZATION; PH; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 33645790539     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.116     Document Type: Article

References (11)

1. Pushing the Shrinking Envelope: A Status Report on Embedded Passives in PCBs. Prismark Partners LLC. December 2000.
2. Ezzell S.A., Bai F., Chien B., et al. Proceedings-Electronic Components and Technology Conference (2001) 1198
3. Lin W.-y., Huang H., Cullen D.K., et al. Mater. Res. Soc. Symp. Proc. 574 (1999) 371
4. Ulrich R., and Schaper L. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces (2000) 38
5. Yoo J.-H., Nam S.-W., Kang S.-K., et al. Microelectron. Eng. 56 (2001) 187
6. T. Kiguchi, et al, in: D.A. Buchanan, et al. (Eds.), (592) 183.
7. X. Lin, PhD Thesis, University of Missouri-Rolla, 1998.
8. Johnson B., Edington J., and O'Keefe M.J. Mater. Sci. Eng. A361 (2003) 225
9. Wang A.Q., Punchaipetch P., Wallace R.M., and Golden T.D. J. Vac. Sci. Technol. 21 3 (2002) 1169
10. Hayes S., Yu P., O'Keefe T., O'Keefe M., and Stoffer J. J. Electrochem. Soc. 149 12 (2002) C623
11. Aksu S., Wang L., and Doyle F.M. J. Electrochem. Soc. 150 11 (2003) G718