Processing and properties of new soluble polyimides

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1198-1200

  Ezzell, S A ^a   Bai, F ^a   Chien, B ^a   Givot, B L ^a   Ayukawa, H ^a   Kobayashi, M ^a   Aoki, S ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPOSITION; CURING; DIELECTRIC FILMS; DRYING; DYNAMIC MECHANICAL ANALYSIS; PERMITTIVITY; POLYIMIDES; SPIN COATING; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

ELECTRICAL STABILITY; IMIDIZATION; METHYL PYRROLIDINONE;

ELECTRONICS PACKAGING;

EID: 0034835464     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)