Study on a new quantitative thermographic evaluation method of three-dimensional subsurface defect for electric apparatus

Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering

Volumn 26, Issue 2, 2006, Pages 159-164

  Fan, Chun Li ^a   Sun, Feng Rui ^a   Yang, Li ^a   Liu, Bao Hua ^b  

^a NAVAL UNIVERSITY OF ENGINEERING   (China)

^b Institute of Naval Aviation   (China)

Author keywords

Electric apparatus; Infrared thermography; Inverse heat conduction problem; Levenberg Marquardt method; Subsurface defect

Indexed keywords

DEFECTS; EVALUATION; HEAT CONDUCTION; HEAT TRANSFER; MATHEMATICAL MODELS; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMOGRAPHY (IMAGING); THREE DIMENSIONAL; TWO DIMENSIONAL;

ELECTRIC APPARATUS; INFRARED THERMOGRAPHY; INVERSE HEAT CONDUCTION PROBLEM; LEVENBERG MARQUARDT METHOD; SUBSURFACE DEFECT;

ELECTRIC EQUIPMENT;

EID: 33645647021     PISSN: 02588013     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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