Thick Pb(Zr,Ti)O3 films fabricated by inducing residual compressive stress during the annealing process

Journal of Materials Research

Volumn 20, Issue 11, 2005, Pages 2898-2901

  Lee, Jae Wung ^a   Choi, Jong Jin ^a   Park, Gun Tae ^a   Park, Chee Sung ^a   Kim, Hyoun Ee ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BENDING (DEFORMATION); COMPRESSIVE STRESS; CRACK INITIATION; ELECTRIC PROPERTIES; MAGNETRON SPUTTERING; RESIDUAL STRESSES; SILICON; SUBSTRATES; THERMAL EXPANSION; THICK FILMS;

RESIDUAL COMPRESSIVE STRESS; SILICON SUBSTRATE;

LEAD COMPOUNDS;

EID: 33645460171     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0383     Document Type: Article

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