Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 158-162

  Hong, Bor Zen ^a   Burrell, Lloyd G ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTIC DEFORMATION; STRAIN; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; THERMAL STRESS; VISCOPLASTICITY;

CERAMIC BALL GRID ARRAY (CBGA) PACKAGES; THERMAL FATIGUE LOADS; VISCOPLASTIC DEFORMATION;

SOLDERED JOINTS;

EID: 0029718033     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)