New CBGA package with improved 2nd level reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1189-1197

  Pendse, Raj ^a   Afshari, B ^a   Butel, N ^a   Leibovitz, J ^a   Hosoi, Y ^a   Shimada, M ^a   Maeda, K ^a   Maeda, M ^a   Yonekura, H ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RELIABILITY; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SOLDERING; STRAIN MEASUREMENT; THERMAL CYCLING; THERMAL EXPANSION;

CERAMIC BALL GRID ARRAY; COEFFICIENT THERMAL EXPANSION; MOISTURE TESTS; SOLDER COLUMN INTERPOSER; TEMPERATURE CYCLING;

ELECTRONICS PACKAGING;

EID: 0034480155     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)