-
1
-
-
1542358759
-
Microneedles for transdermal drug delivery
-
10.1016/j.addr.2003.10.023 0169-409X
-
Prausnitz M 2004 Microneedles for transdermal drug delivery Adv. Drug Deliv. Rev. 56 581-7
-
(2004)
Adv. Drug Deliv. Rev.
, vol.56
, Issue.5
, pp. 581-587
-
-
Prausnitz, M.1
-
3
-
-
18144397536
-
Microsystems for drug and gene delivery
-
10.1109/JPROC.2003.820542 0018-9219
-
Reed M L and Lye W K 2004 Microsystems for drug and gene delivery Proc. IEEE 92 56-75
-
(2004)
Proc. IEEE
, vol.92
, Issue.1
, pp. 56-75
-
-
Reed, M.L.1
Lye, W.K.2
-
4
-
-
0034578084
-
Microfabricated microneedles for gene and drug delivery
-
10.1146/annurev.bioeng.2.1.289 1523-9829
-
McAllister D V, Allen M G and Prausnitz M R 2000 Microfabricated microneedles for gene and drug delivery Annu. Rev. Biomed. Eng. 2 289-313
-
(2000)
Annu. Rev. Biomed. Eng.
, vol.2
, Issue.1
, pp. 289-313
-
-
McAllister, D.V.1
Allen, M.G.2
Prausnitz, M.R.3
-
6
-
-
4344666269
-
Microneedle array for transdermal biological fluid extraction and in situ analysis
-
10.1016/j.sna.2003.11.008 0924-4247 A
-
Mukerjee E V, Collins S D, Isseroff R R and Smith R L 2004 Microneedle array for transdermal biological fluid extraction and in situ analysis Sensors Actuators A 114 267-75
-
(2004)
Sensors Actuators
, vol.114
, pp. 267-275
-
-
Mukerjee, E.V.1
Collins, S.D.2
Isseroff, R.R.3
Smith, R.L.4
-
7
-
-
0742301752
-
Silicon micromachined hollow microneedles for transdermal liquid transfer
-
10.1109/JMEMS.2003.820293 1057-7157
-
Gardeniers H J G E, Luttge R, Berenschot E J W, de Boer M J, Yeshurun S Y, Hefetz M, van't Oever R and van den Berg A 2003 Silicon micromachined hollow microneedles for transdermal liquid transfer J. Microelectromech. Syst. 12 855-62
-
(2003)
J. Microelectromech. Syst.
, vol.12
, Issue.6
, pp. 855-862
-
-
Gardeniers, H.J.G.E.1
Luttge, R.2
Berenschot, E.J.W.3
De Boer, M.J.4
Yeshurun, S.Y.5
Hefetz, M.6
Van'T Oever, R.7
Van Den Berg, A.8
-
8
-
-
0037871729
-
Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer
-
10.1109/JMEMS.2003.809959 1057-7157
-
Griss P and Stemme G 2003 Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer J. Microelectromech. Syst. 12 296-301
-
(2003)
J. Microelectromech. Syst.
, vol.12
, Issue.3
, pp. 296-301
-
-
Griss, P.1
Stemme, G.2
-
9
-
-
0031222143
-
Fabrication of high aspect ratio silicon micro-tips for field emission devices
-
10.1023/A:1018692711614 0022-2461
-
Chung I J, Murfett D B, Hariz A and Haskard M R 1997 Fabrication of high aspect ratio silicon micro-tips for field emission devices J. Mater. Sci. 32 4999-5003
-
(1997)
J. Mater. Sci.
, vol.32
, Issue.18
, pp. 4999-5003
-
-
Chung, I.J.1
Murfett, D.B.2
Hariz, A.3
Haskard, M.R.4
-
10
-
-
0038186383
-
A new model for Si{1 0 0} convex corner undercutting in anisotropic KOH etching
-
0960-1317 311
-
Schröder H and Obermeier E 2000 A new model for Si{1 0 0} convex corner undercutting in anisotropic KOH etching J. Micromech. Microeng 10 163-70
-
(2000)
J. Micromech. Microeng
, vol.10
, Issue.2
, pp. 163-170
-
-
Schröder, H.1
Obermeier, E.2
-
11
-
-
17444372064
-
On the Miller-indices determination of Si{1 0 0} convex corner undercut planes
-
0960-1317 022
-
Chang Chien W T, Chang C O, Lo Y C, Li Z W and Chou C S 2005 On the Miller-indices determination of Si{1 0 0} convex corner undercut planes J. Micromech. Microeng. 15 833-42
-
(2005)
J. Micromech. Microeng.
, vol.15
, Issue.4
, pp. 833-842
-
-
Chang Chien, W.T.1
Chang, C.O.2
Lo, Y.C.3
Li, Z.W.4
Chou, C.S.5
-
12
-
-
0018030427
-
Anisotropic etching of silicon
-
0018-9383
-
Bean K E 1978 Anisotropic etching of silicon IEEE Trans. Electron Devices 25 1185
-
(1978)
IEEE Trans. Electron Devices
, vol.25
, pp. 1185
-
-
Bean, K.E.1
-
13
-
-
0028510757
-
Morphology of etch hillock defects created during anisotropic etching of silicon
-
0960-1317 008
-
Tan S S, Reed M, Han H and Boudreau R 1994 Morphology of etch hillock defects created during anisotropic etching of silicon J. Micromech. Microeng. 4 147-55
-
(1994)
J. Micromech. Microeng.
, vol.4
, Issue.3
, pp. 147-155
-
-
Tan, S.S.1
Reed, M.2
Han, H.3
Boudreau, R.4
-
14
-
-
0029373940
-
Fabrication of mesas and octagonal cones in silicon by wet chemical etching
-
0960-1317 008
-
Trant E, Kimt E S and Leet S Y 1995 Fabrication of mesas and octagonal cones in silicon by wet chemical etching J. Micromech. Microeng. 5 251-6
-
(1995)
J. Micromech. Microeng.
, vol.5
, Issue.3
, pp. 251-256
-
-
Trant, E.1
Kimt, E.S.2
Leet, S.Y.3
-
15
-
-
0036544447
-
A model explaining mask-corner undercut phenomena in anisotropic silicon etching: A saddle point in the etching rate diagram
-
10.1016/S0924-4247(02)00017-1 0924-4247 A
-
Shikida M, Nanbara K, Koizumi T, Sasaki H, Odagaki M, Sato K, Ando M, Furuta S and Asaumi K 2002 A model explaining mask-corner undercut phenomena in anisotropic silicon etching: a saddle point in the etching rate diagram Sensors Actuators A 97-98 758-63
-
(2002)
Sensors Actuators
, vol.97-98
, Issue.3
, pp. 758-763
-
-
Shikida, M.1
Nanbara, K.2
Koizumi, T.3
Sasaki, H.4
Odagaki, M.5
Sato, K.6
Ando, M.7
Furuta, S.8
Asaumi, K.9
-
16
-
-
0025497671
-
Methods for the fabrication of convex corners in anisotropic etching of (1 0 0) silicon in aqueous KOH
-
0924-4247 A
-
Offereins H L, Kohl K and Sandmaier H 1991 Methods for the fabrication of convex corners in anisotropic etching of (1 0 0) silicon in aqueous KOH Sensors Actuators A 25-27 9-13
-
(1991)
Sensors Actuators
, vol.25-27
, pp. 9-13
-
-
Offereins, H.L.1
Kohl, K.2
Sandmaier, H.3
-
17
-
-
0027845301
-
An ion milling pattern transfer technique for fabrication of three-dimensional micromechanical structures
-
10.1109/84.273091 1057-7157
-
Dizon R, Han H, Russel A G and Reed M L 1993 An ion milling pattern transfer technique for fabrication of three-dimensional micromechanical structures J. Microelectromech. Syst. 2 151-8
-
(1993)
J. Microelectromech. Syst.
, vol.2
, Issue.4
, pp. 151-158
-
-
Dizon, R.1
Han, H.2
Russel, A.G.3
Reed, M.L.4
-
18
-
-
0035980427
-
The influence of atomic configuration of (h k l) planes on adsorption processes associated with anisotropic etching of silicon
-
10.1016/S0924-4247(01)00690-2 0924-4247 A
-
Zubel I 2001 The influence of atomic configuration of (h k l) planes on adsorption processes associated with anisotropic etching of silicon Sensors Actuators A 94 76-86
-
(2001)
Sensors Actuators
, vol.94
, Issue.1-2
, pp. 76-86
-
-
Zubel, I.1
-
19
-
-
22144493011
-
Process optimisation and characterisation of silicon microneedles fabricated by wet etch technology
-
10.1016/j.mejo.2005.04.044 0026-2692
-
Wilke N, Ye S R, Mulcahy A and Morrissey A 2005 Process optimisation and characterisation of silicon microneedles fabricated by wet etch technology Microelectron. J. 37 650-6
-
(2005)
Microelectron. J.
, vol.36
, Issue.7
, pp. 650-656
-
-
Wilke, N.1
Ye, S.R.2
Mulcahy, A.3
Morrissey, A.4
-
20
-
-
69749092025
-
Etching simulation of negative sloped planes at convex mask corners in Si
-
10.1016/j.sna.2004.06.028 0924-4247 A
-
Chahoud M 2005 Etching simulation of negative sloped planes at convex mask corners in Si Sensors Actuators A 117 356-63
-
(2005)
Sensors Actuators
, vol.117
, Issue.2
, pp. 356-363
-
-
Chahoud, M.1
-
21
-
-
0036864193
-
Anomalies in modeling of anisotropic etching of silicon: Facet boundary effects
-
10.1116/1.1513790 0734-2101 A
-
Elalamy Z, Landsberger L M, Pandy A, Kahrizi M, Stateikina I and Michel S 2002 Anomalies in modeling of anisotropic etching of silicon: facet boundary effects J. Vac. Sci. Technol. A 20 1927-33
-
(2002)
J. Vac. Sci. Technol.
, vol.20
, Issue.6
, pp. 1927-1933
-
-
Elalamy, Z.1
Landsberger, L.M.2
Pandy, A.3
Kahrizi, M.4
Stateikina, I.5
Michel, S.6
-
22
-
-
33645109250
-
-
Laermer F and Schilp A 1996 Method of anisotropically etching silicon US 5501 893
-
(1996)
-
-
Laermer, F.1
Schilp, A.2
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