ALD TaN reliability improvement in dual damascene structures

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 699-705

  Michaelson, Lynne M ^a   Thrasher, Stacye R ^a   Besling, Wim F A ^b   Rasco, Michelle ^a   Acosta, Eddie ^a   Jiang, Zhi Xiong ^a   Kim, Kiwoon ^a   Kirksey, Stuart H ^a   Rose, Stewart H ^a   Vanypre, Thomas ^c  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b NXP SEMICONDUCTORS   (Netherlands)

^c STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER INTEGRATION; COPPER DIFFUSION; COPPER INTERFACE; SIDEWALLS;

ADHESION; ELECTROMIGRATION; ETCHING; HEAT TREATMENT; RELIABILITY; TANTALUM COMPOUNDS;

COPPER;

EID: 23844553807     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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